TWS Earphone Dispensing
As an important assembly process of TWS earphones, the dispensing process is widely adopted by many manufacturers in the production of TWS earphones. Because of the wireless design of TWS earphones

Process Essentials

01 Complicated dispensing path

Small in size, TWS earphones are about 20-30 mm in length and height. Different from the straight structure of mobile phones, TWS earphones are small and round in shape. A common boxed Bluetooth headset, for example, has an outer diameter of about 5~7mm at the bottom of the plug, while the inner diameter is usually less than 4mm, and it also has diverse internal precision components and complex structure. The dispensing process and path are particularly complex. For plug gap filling, for example, it is required to fill with glue evenly in a 0.25mm wide arc-shaped gap behind the top of slope, and ensure sufficient internal filling without glue overflow. The rhythm should be less than or equivalent to 1s.

 

02 High requirements for glue control

In addition, the consistent amount of glue will also directly affect product quality. There are high requirements for the glue quantity control of TWS earphones. For the plug gap filling mentioned above, it is required to accurately fill 1.68mg glue in each uniform gap, with glue weight accurate to ±3%. In order to reach the standard, the technological process at this link requires the dispenser with extremely high accuracy, speed and stability.

 

SAMON’s Precision Dispensing Solutions

SAMON's outstanding one-stop technology R&D and production service and advanced solution design capability are favored by customers, and SAMON chose to fill and dispense the plug gap of Bluetooth headsets by introducing the multi-function dispensing system of SAMON Fit10 multi-axis platform.

With years of manufacturing experience and technology accumulated and mastered, SAMON has launched solutions from scratch for this highly complex dispensing project in cooperation with customers. SAMON continues to strengthen service construction step by step, while strengthening product performance and improving technology research and development. In addition, based on customer needs, SAMON innovatively designs the dispensing process, completes thermosetting sealing through gap filling, and provides a perfect digital solution for this dispensing process, characterized by precise glue control, low defect and high productivity.                                   

                             Fit10多轴平台多功能点胶系统

 

Advantages of SAMON’s Solutions

  • To meet the precise glue quantity control of 1.68mgand control the error within 3%, Fit10 fully secures the consistency of product glue volume by weighing glue volume compensation, which is higher than 5%, the error standard required by conventional precise dispensing process.

  •  Based on the instability of product assembly, SAMON implements precise grabbing to ensure the accurate dispensing position by the dual MARK positioning at single grab.
  • For the step array function, we need to give an angle because of the arc-shaped dispensing on the non-level surface. Then, the function of step array is developed for this project. Precise dispensing is carried out in ladder pattern on the 18×6 matrix with a certain gradient, which perfectly solves the difficulties in the production process.
  • In combination with UV light source detection, AOI can detect glue discontinuity, glue insufficiency, glue overflow, and scattered points, and implements micron-level automatic detection and positioning, with nearly zero omission detection of small defects.

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