In the process of underfill dispensing, it is essential to ensure the dispensing quality through glue weight control, dispensing path, dispensing angle and AOI detection. In the actual dispensing process, the main process requirements for underfill include the uniform spreading of glue, free from scattered points or bubbles.

Application Fields

Underfill dispensing process is widely applied in consumer electronics industry, such as PCB or FPC relating to mobile phone, wearable, TWS, PAD, and others .

Applicable Equipment

In response to the above process requirements, Samon has launched the FIT series in-line universal dispensers for SMT dispensing application.


●  Satisfy various customer requirements by coping with base plates or substrates of different sizes


●  Flexibly and freely select a variety of kit modules such as ID identification, precision weighing, bottom heating and others


●  Support double-track independent control, simple and flexible software operation


● Support CAD import and graphic preview, and optimize track editing time


●  Enjoy a simple and concise programming environment, and provide such functions as track mutual copy, matrix call, repeat track, AOI review, etc., and ensure flexible machine application


●  Offer a variety of optional configurations and software packages to satisfy various dispensing needs