The dispensing quality is ensured through glue weight control, dispensing path, and AOI inspection in the Encap dispensing process. The dispensing process has strict requirements on the overflow of glue. No glue is allowed on the surface of the IC, and no bubbles are permitted during dispensing. These are the process essentials of Encap.

Application Fields

Encap dispensing process is widely applied in the electronics industry, such as the PCB or FPC relating to mobile phones, wearables, automotive electronics and others.

Applicable Equipment

In response to the above process requirements, the production equipment has to support the monitoring of glue quantity variation, feeding pressure, and real-time MES uploading. Samon's standard dispensing system Fit series can adapt to a variety of fluid spraying applications. The modular structure allows for flexible switching of functional options according to actual application scenarios, supports for rapid replacement and assembly, and fits for various spraying application scenarios with strong expansibility.

●  Satisfy various customer requirements by coping with base plates or substrates of different sizes

●  Flexibly and freely select a variety of kit modules such as ID identification, precision weighing, bottom heating and others

●  Support double-track independent control, simple and flexible software operation

●  Support CAD import and graphic preview, and optimize track editing time

●  Enjoy a simple and concise programming environment, and provide such functions as track mutual copy, matrix call, repeat track, AOI review, etc., and ensure flexible machine application

●  Offer a variety of optional configurations and software packages to satisfy various dispensing needs