Mini LED Dispensing
The dispensing process is also being upgraded with the development of Mini LED backlight packaging technology. Mini LED backlight technology, as a high-end advanced version of LCD, adopts a direct-dow

Process Essentials

  •  Large size backlight (4k/8k TV)

The Lens ball head glue process is usually applied in the Mini LED packaging process, that is, the transparent optical glue, instead of the traditional lens refraction chip, is used as a molding package to emit light and improve the condensing and lighting effects.

This process requires extremely high consistency in glue quantity and molding concentricity, that is, when multiple glue points are sprayed at each light-emitting chip position, the deviation between the center position of glue point and light-emitting chip is ≤0.1mm or even lower, and bubbles are not generated during dispensing process. SAMON implements synchronous dispensing with dual valve,achieves single chip package TT≤60ms, and ensures the uniform light emitting of the entire panel. 

     

 

  • Small and medium size backlight (tablets, laptops, VR glasses, smart watches)

The DAM glue process is mostly used. Different from TV products, above products have smaller substrate and higher chip density. Usually, the line around the dam is used to form a crisscross- or pound-shaped grid to prevent light interference and ensure the light quality.

 

This kind of process requires precise and effective control of the filling amount of glue and the continuous uniformity of scribe thickness, and the absence of obvious bulges at the junctions which will create gaps during the pressing process, resulting in cross light. Based on repeated calculations and experiments, SAMON process team adopts a novel frequency conversion method at the junctions to ensure that the joint is perfectly connected, with uniform and continuous glue line, without obvious protrusions, and the working speed can reach ≥200mm/s.

 

  • Mini direct display (outdoor display)

In order to secure the tens of thousands of light-emitting chips without falling off, SAMON evenly fills the display panel using the Under Fill dispensing process. This requires precise control of the glue around each light-emitting chip for underfilling. Each micro-light-emitting chip should be evenly filled, and the glue cannot reach the surface of the chips, and no scattering is allowed during dispensing.

 

SAMON’s Precision Dispensing Equipment

With an algorithm-based intelligent control system and a massive process application database, the Fit20LM multi-axis platform multi-function dispensing system can meet different quality control requirements because of its outstanding intelligent dispensing. In addition, with years of manufacturing experience and technology accumulated and mastered, SAMON also continues to strengthen service construction step by step, while strengthening product performance and improving technology research and development, and provides one-stop Mini LED dispensing solutions to facilitate automation upgrade.

 

  • Speedy,Stable and  Reliable Precise  Dispensing

The high-precision linear motor for dual-drive symmetrical control significantly improves the dispensing speed and production efficiency, with single chip package TT≤60ms. High-resolution grating scale and Y-direction dual-drive structure maintain the comprehensive accuracy.

 

  • Dedicated  Research and  Development, Mini LED  Backlight

Fully automatic multi-head dispensing device developed for MiniLED backlight dispensing applications, is suitable for dam, filling, and Lens processes in the dispensing process of MiniLED backlight modules.

 

  • Significantly Improved Efficiency and Carrying Multiple  Valves

Depending on the process requirements, the flexible system can be simultaneously equipped with synchronous or asynchronous double valves to meet various dispensing needs and maintain a perfect balance between dispensing accuracy and efficiency.

 

  • Wide range of applications, the first choice for intensive and fine dispensing

It is suitable for dispensing processes such as mini LED backlight modules in vehicles, laptops, gaming screens, TV screens, etc.

While launching the special dispensing equipment for Mini LED, SAMON is committed to create an independent and interconnected intelligent manufacturing ecosystem, provide multi-machine series solutions and effectively shorten the production cycle and improve production efficiency.

Before dispensing, plasma surface treatment is performed to treat pollutants and oxide layers on the surface of substrates, brackets and other devices, so as to improve the wetting ability of the material surface, and various materials can be coated and plated to enhance the adhesion and bonding force and safeguard the entire process and quality.

 

Mini LED  Dispensing  Inspection

  • Position accuracy detection

SAMON's optical system detection solution can accurately detect the diameter of the glue point, the distance from the center of chip to the outer diameter of glue edge, and the center deviation (the deviation between the center of chip and of glue point). At present, the motion control can help control the visual inspection time (TT) within 100ms/piece, accurate to the micron level.

 

  • Height measurement of lens glue

SAMON solution has obvious advantages in the cost and technology. In the Mini LED dispensing process, SAMON’s Vision Inspection solution implements high-speed and precise glue measurement by combining the optical system with mobile platform and precision motion control system. SAMON’s glue height inspection system can output more than 1,000 micron-level inspection data, perfectly satisfying the efficient and accurate production requirements of Mini LED.

 

  • DAM gluedetection

SAMON adopts a high-precision 3D camera for DAM glue detection, and ensures fast scanning with the smallest and lightest weight. After image processing, the detected width and height value of glue line can be displayed in text with micron level accuracy. 

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