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SAMON Technology's Micro OLED ODF glass encapsulation equipment has broken through overseas technical barriers and been successfully integrated into the production lines of leading domestic manufactur
2025-07-17 19:07:56
As a core display component for AR/VR/MR, Micro OLED silicon-based microdisplays achieve high brightness and high resolution, while featuring small size, light weight, simple structure, low cost and excellent color performance. They represent the optimal solution in the evolution of today’s wearable and embedded display technologies.
 
Amid the ongoing miniaturization trend in consumer electronics, this technology is set to reshape the rules of the XR optical display industry.
 
Steady Rapid Growth in New Display Investments
 
Since 2025, Brilliance China and TCL Industrial have signed a joint venture agreement for intelligent vehicle solutions with an investment of 1.4 billion yuan. Xitai Technology’s semiconductor microdisplay industrialization project, with a total investment of 4 billion yuan, has settled in Mianyang High-tech Zone.
Visionox and Kunshan Economic and Technological Development Zone will establish Kunshan Global New Display Industry Innovation Center with a total investment of 5 billion yuan.HKC invests 10 billion yuan to build a full-color M-LED new display chip base in Nanchong City.(Source: China Electronics News)
 
As the core of next-generation display technology, Micro OLED’s micro-nano glass encapsulation — involving precision fluid processes such as dispensing and bonding — directly determines the panel’s display uniformity, service life and reliability, resulting in extremely stringent yield requirements.For a long time, high-end intelligent equipment for Micro OLED has been monopolized by a small number of foreign enterprises, with high equipment costs and supply chain risks.
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SAMON Technology Has Realized the Localized Implementation of Dispensing and Bonding Technology
The Micro OLED dispensing and bonding process draws on the core concept of the Liquid Crystal Display (LCD) One Drop Fill (ODF) process. By precisely dispensing encapsulation materials on the Micro OLED substrate and then performing precision bonding, it achieves high-precision, high-efficiency and high-yield encapsulation of microdisplay devices, solving the key challenges in traditional Micro OLED encapsulation.

 

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※ Video of SAMON Technology's Micro OLED Dispensing and Bonding Equipment. Copying and reprinting are prohibited without permission.

SAMON's R&D team has spent several years achieving systematic breakthroughs in key technologies such as material fluid mechanics, motion control algorithms, and visual compensation. Finally, they have developed the Micro OLED ODF micro-nano glass encapsulation equipment, which has been successfully introduced and put into operation on customers' production lines. This equipment integrates two core technologies: high-precision dispensing control and high-precision vacuum bonding, with comprehensive performance comparable to the international level.
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※ Video of SAMON Technology's Micro OLED Dispensing and Bonding Equipment. Copying and reprinting are prohibited without permission.
The successful landing of SAMON's Micro OLED ODF micro-nano glass encapsulation equipment this time not only provides customers with a high-performance and cost-effective domestic alternative solution, but also proves to the market SAMON's independent innovation capability in the field of cutting-edge display equipment, injecting a shot in the arm for the independent controllability, safety and stability of the domestic Micro OLED industrial chain. This reflects that domestic technology has achieved a major breakthrough in the field of core manufacturing equipment for high-precision, high-efficiency and large-size microdisplay panels, breaking the long-term technical monopoly dominated by foreign countries.

 

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According to industry forecasts, the global microdisplay panel market size will exceed 10 billion US dollars in 2025. SAMON Technology will continue to invest in R&D, deepen cooperation with industrial chain partners, promote the iteration and upgrading of domestic high-end semiconductor display equipment towards higher precision, larger size and greater intelligence, and contribute to China's acquisition of core equipment discourse power in the global competition of next-generation display technologies.