In-line Dispensing
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SAMON Lecture | Demystifying the Underfill Process
2025-09-25 16:56:37
With the development of electronic products towards miniaturization, thinning and high performance, IC packaging also tends to develop in the direction of miniaturization and high integration. The use of underfill can disperse the stress borne by the chip surface and thus improve the reliability of the entire product, so underfill has become a necessary process to improve the reliability of electronic products. The underfill process is to dispense epoxy resin glue on the edge of the flip chip. Through the "capillary effect", the glue is drawn to the opposite side of the component to complete the bottom filling process, and then the glue is cured by heating.
Underfill can solve many problems of precision electronic components. For example, for processes such as CSP, BGA, and POP, underfill can greatly improve their impact resistance; for FLIP CHIP, thermal stress generated by inconsistent Coefficient of Thermal Expansion (CTE) can easily lead to solder ball failure, and underfill can effectively improve the ability to resist thermal stress.
The Under Fill dispensing process is widely used in the consumer electronics industry, such as PCB or FPC associated with mobile phones, wearables, TWS, and automotive electronics.
Process Requirements
1. For underfill, the glue must first be heated, the temperature of the glue must be maintained, and the dispensing equipment must have a thermal management function.
2. During the dispensing process, glue volume control, dispensing path, waiting time and dispensing angle planning are the key process points to ensure uniform underfill diffusion, no scattered points, no bubbles, and extremely narrow glue overflow width.
3. The underfill process requires heating the components, which can accelerate the capillary flow rate of the glue and provide a favorable guarantee for normal curing.
Selection of Underfill Glue
● Good fluidity, which can easily penetrate into the bottom of BGA through capillary phenomenon, facilitating operation
● Appropriate toughness and strength to disperse and reduce the stress on solder balls
● Reduce the CTE difference between the chip and the substrate
● Meet the cyclic temperature requirements
● Maintainability and simple process
Adaptable Equipment
※Fit Series High-Precision Online Dispensing System
SAMON Technology's Fit series high-precision online dispensing system, with superior performance and precise fluid control technology, helps customers achieve high-quality underfill processes, especially suitable for high-precision electronic fields such as 3C and wearable devices.
● Capable of handling substrates or base materials of various sizes to meet the requirements of different customers
● Flexible selection of kit modules such as ID identification, precision weighing, and bottom heating
● Dual-track independent control with simple and flexible software operation
● Supports CAD import and graphic preview functions to optimize trajectory editing time
● User-friendly programming environment with functions such as trajectory copying, matrix calling, repeated trajectories, and AOI review to ensure flexible machine application
● Provides a variety of optional configurations and software packages to meet various dispensing needs Adaptable Equipment
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