2. During the dispensing process, glue volume control, dispensing path, waiting time and dispensing angle planning are the key process points to ensure uniform underfill diffusion, no scattered points, no bubbles, and extremely narrow glue overflow width.
3. The underfill process requires heating the components, which can accelerate the capillary flow rate of the glue and provide a favorable guarantee for normal curing.
Selection of Underfill Glue
● Good fluidity, which can easily penetrate into the bottom of BGA through capillary phenomenon, facilitating operation
● Appropriate toughness and strength to disperse and reduce the stress on solder balls
● Reduce the CTE difference between the chip and the substrate
● Meet the cyclic temperature requirements
● Maintainability and simple process
Adaptable Equipment