In-line Dispensing
Advantages in Performance
Products for board-level packaging feature large dimensions (approximately 510×515 mm) and extremely high flatness requirements. SAMON adopts high-precision multi-servo control, achieving a flatness of ±20 μm. This greatly suppresses warpage and avoids defects such as cracks and scratches.
The lift platform with precise temperature control can be heated up to 150℃, with 64-point measurement and temperature control accuracy ≤±2℃ for consistent performance.
Equipped with a Y-axis dual-drive linear motor, it reaches a maximum speed of 2000 mm/s and maximum acceleration of 2.0 g. Even at high speeds, positioning accuracy is controlled within ≤±2 μm@3σ.
The dual-forcer module is separately equipped with high-precision cameras, forming two independent working units. It supports independent or collaborative dispensing with single/dual valves, doubling efficiency while maintaining dispensing accuracy.
Fitted with SAMON’s self-developed Quark high-precision quick-release piezoelectric jet valve, it enables glue volume control down to 0.2 nl, meeting strict film thickness and yield requirements. A jet frequency of 1000 Hz ensures high-efficiency production.
The algorithm-based intelligent dispensing control system automatically adjusts dispensing parameters according to actual production, enabling simplified and efficient fully automatic dispensing.
Board-level packaging has extremely stringent environmental requirements. SAMON uses high-strength mirror-finish stainless steel clean enclosures to isolate external dust, equipped with FFU with air velocity >0.45 m/s for in-device dust removal, and plasma air bars to eliminate static electricity in the working area. These three measures ensure Class 100 cleanliness and protect chip integrity.
Advanced fully automatic optical inspection (AOI) system enables micron-level automatic detection and positioning, with near-zero missed detection for subtle defects, ensuring product yield >99.5%.
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