Fit20 Compact In-Line Precision Dispensing System

The system is suitable for bonding and coating circuit boards, electronic devices, shells, chips and other parts, and for sealing and assembling such electronic products as mobile phones,

Advantages in Performance

High precision and high speed

Semiconductor-grade jet dispensing provides the minimum glue point of 0.20 nl, the minimum glue width of 0.3 mm, and the maximum spray frequency of 1,000 points/second.

Stable and reliable

Integrated design, stable structure, combined with advanced control software and high utilization rate, ensures high quality and high efficiency. The use of ultra-high-quality components features stability and durability.

Flexibility

Modular functional components based on industry standards, which are flexible, plug and play, can satisfy varied production needs.

Precision Detection

Advanced automatic optical inspection system (AOI) implements micron-level automatic detection and positioning, with nearly zero omission detection of small defects, and ensures product yield ≥ 99.5%

Intelligent and Efficient

The algorithm-based intelligent dispensing control system can, based on the actual production scenarios, automatically set and adjust dispensing parameters, and realize high-quality and efficient automatic dispensing.

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