With the rise and development of the metaverse, Samon Technology has continued to deepen its expertise in high-precision micro-bonding processes for VR/XR/AR wearable devices, and has accumulated years of industry experience. In recent years, Samon Technology has provided a full range of high-precision micro optical bonding and fluid dispensing equipment to many domestic and international metaverse wearable device brands and manufacturers.

A well-known global internet technology company has successfully launched the AR special-shaped lens bonding equipment developed by Samon Technology at its R&D center across the ocean. This equipment is providing optical solutions for a new generation of AR smart wearable glasses to be launched in the next two years.

• • STH Process

  It bonds OCA (Optically Clear Adhesive) to resin optical lenses. This step requires ensuring precise bonding between the OCA and the lenses, laying a solid foundation for subsequent processes.

  • HTH Process

  It bonds waveguide sheets to optical lenses. This step demands extremely high precision to ensure that the positional relationship between the optical lenses and waveguide sheets meets the design specifications.

  In the field of AR glasses manufacturing, bonding precision is one of the key factors determining product performance. Samon Technology’s equipment not only meets the customer’s requirement of ±0.1mm tolerance for OCA bonding but also achieves a high standard of ±0.05mm tolerance for the bonding between waveguide sheets and optical lenses. This precision level is among the top tier in the full bonding industry, which can reliably guarantee the optical performance and user experience of AR glasses. The equipment features a concise and efficient process flow and has achieved three major technological breakthroughs:

  • 3D Special-Shaped Structure: The equipment can accurately process the 3D special-shaped structure of AR glass lenses, ensuring that lenses with complex shapes do not deform or generate errors during the bonding process.
  • High-Precision Bonding: The equipment can achieve a bonding precision of ±0.05mm. Especially in the HTH process, the control of the planar positional relationship between waveguide sheets and lenses reaches an industry-leading level. This precision requirement is relatively high in the full bonding industry, with CPK > 1.33 under the tolerance of ±0.05mm, far exceeding the industry average.
  • Bubble Suppression: In optical bonding, bubbles not only affect bonding strength but also interfere with the transmission of optical signals, making them the biggest factor affecting product yield. Samon Technology comprehensively suppresses bubbles from multiple dimensions, including environment, bonding, defoaming, and detection, ensuring an improvement in product yield.